As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking chips on top of each other. This vertically layered architecture could allow high-performance processors, like those used for artificial intelligence, to be packaged closely with other highly specialized chips for communication or imaging. But technologists everywhere face a major challenge: how to prevent these stacks from overheating.
New chip tests cooling solutions for stacked microelectronics
